TAIPEI — Taiwanese silicon wafer manufacturer GlobalWafers said Friday it would invest an additional $4 billion in the United States to meet growing customer demand there, as it officially ...

Simply look to the western sky after sunset. The delicate form of the crescent moon is set to draw close to the planet Jupiter in the post-sunset sky on April 29, before later making its closest ...

RIPON, WIS. – Signature Wafer & Chocolate Co. and Hormel Foods Corp. have added two flavors and one reformulated flavor to its Skippy peanut butter wafer bar lineup, which will now be available ...

MORRIS, Ind. — A laboratory analysis turned up nothing miraculous about red marks found on a Communion wafer at a Catholic church in Indiana. The discovery at St. Anthony of Padua Catholic ...

FOB China prices for G12 wafers remained stable this week, with Mono PERC G12 wafers priced at $0.208 per pc and n-type G12 wafers at $0.196/pc. In contrast, M10 wafer prices saw an increase ...

GameSpot may get a commission from retail offers. The latest Palworld update v0.5.0 added several new features to the game, and it finally lets you make use of all the schematics duplicates you ...

The shift from planar SoCs to 3D-ICs and advanced packages requires much thinner wafers in order to improve performance and reduce power, reducing the distance that signals need to travel and the ...

WTF?! A Reddit user claims to have discovered an entire 12nm TSMC wafer discarded in a dumpster near one of the chipmaker's fabs in China. While it was just a test wafer, the find sparked jokes ...

NexWafe is one of a few companies looking to build US wafer capacity. Image: NexWafe. The US government has clarified specific domestic content measures to support US silicon wafer manufacturers ...

A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

The global wafer foundry industry will grow by a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029, reaching US$270 billion, driven by AI and high-performance computing (HPC ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...