Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

Abstract: 300mm Si wafer-scale oxide fusion bonding and mechanical/wet etch assisted wafer thinning processes were combined with a TSV-last 3D integration strategy to fabricate electrical open/short ...

A co-design flow of packaging and ASIC design allows customers to evaluate and balance the many factors at play. A co-design ...

Abstract: In semiconductor manufacturing, wafer fabrication is followed by chip assembly where individual dies are assembled as a packaged chip. In between, dies are tested in terms of their ...

NanoScience Technology Center, University of Central Florida, Orlando, Florida 32826, United States Department of Materials Science and Engineering, University of Central Florida, Orlando, Florida ...

Wolfspeed is preparing to file for bankruptcy within a matter of weeks as the publicly traded chip component maker struggles to address its debt pile, according to sources familiar with the matter ...

SHERMAN, Texas (KXII) - Texas Instruments’ first of four new semiconductor manufacturing plants in Sherman is nearing completion. “We’ve completed construction on the first factory, the team ...

Image by [dynam1keNL] via reddit But sir! I can’t believe I missed [dynam1keNL]’s initial flat offering from about a year ago, the mikefive, which came about when he and some friends ordered ...

Image by [dynam1keNL] via reddit But sir! I can’t believe I missed [dynam1keNL]’s initial flat offering from about a year ago, the mikefive, which came about when he and some friends ordered ...

Taiwanese chip materials maker GlobalWafers Co plans to raise its investments in the US to $7.5 billion, sating increasing demand as President Donald Trump tries to boost advanced manufacturing at ...

TAIPEI — Taiwanese silicon wafer manufacturer GlobalWafers said Friday it would invest an additional $4 billion in the United States to meet growing customer demand there, as it officially ...