SALT LAKE CITY – The Catholic Diocese of Salt Lake City says a bleeding host reported after a communion wafer turned water red was caused by bread mold, not a miracle. Officials said Wednesday ...

When the mold was etched away ... It took cutting single crystals into wafers to truly understand silicon's semiconducting properties. Today, nanotechnology allows incredibly detailed nanoscale ...

Figure 2: Design of the silicon wafer mold. Fabrication of the silicon wafer mold. The microstructures of the microfluidic dissection platform are produced by casting PDMS against a silicon wafer ...

The Catholic Diocese of Salt Lake City says a communion wafer, seen here, that turned water red was caused by bread mold, not a miracle. (Catholic Diocese of Salt Lake City/Facebook) SALT LAKE ...

In February 2025, St. Anthony of Padua Catholic Church in Morris, Indiana, became the center of attention when red spots were discovered on a communion wafer, leading some parishioners to ...

the mold-first, face-down approach avoids the need for fabricating the copper pillars and for the back grinding, so it has a lower fabrication cost. It is best suited for low I/O count applications; ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a ...