and each wafer was over-molded with EMC and thermally cured. The molded wafers were then debonded either mechanically or by laser ablation and cleaned to remove residual bonding material. For ...

In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a ...

ht. 2 3/4 lg. 5 1/4 in.

stacked wafers, MEMS, and over-molded wafers. "The SpinSAM AMI system represents a significant advancement in wafer inspection technology, offering customers unmatched speed and precision to ...