An energy harvesting demonstration design, developed jointly with TDK, features the nPZero power saving IC continuously ...

Visitors to the SG Wireless Stand 3-501 in Hall 3 at the Embedded World exhibition (Nuremberg, Germany, 11-13 March 2025) can ...

Gain insights on the Bluetooth module RNBD350 and QCC711, focusing on their development kits and low-energy operation.

Renesas’ ultra-low-power RA4L1 MCUs with capacitive touch and segment LCD support target metering, IoT sensors and smart locks.

Modern wireless devices face increasing challenges as more wireless technologies compete for limited signal space. Sudhirkumar Prajapati addresses these challenges through advanced semiconductor ...

JEDEC and OCP (Open Compute Project Foundation) announce new Chiplet Design Kits for EDA use covering four areas: Assembly, Substrate, Material and Test.

This breakthrough solution—developed in partnership with chip-maker Beken—delivers an all-in-one toolkit that empowers ...

NB-IoT from 3GPP has become a leading LPWAN connectivity protocol. It is very important that the design aspects of the NB-IoT device protocol stack ensure low module cost and low energy consumption.

The content ranges from general design best practices to specifics for select tools and methods, but all are presented to support developing embedded devices in IoT applications. The class includes ...