LIVERMORE, Calif. — FormFactor Inc. here today (Feb. 15) announced a major advancement in probe-card technology that enables IC manufacturers to test up to 128 chips on a wafer with a single ...

Thus, you need to probe the wafer. The TESLA200 on-wafer probing system from FormFactor can test devices up to 3000 V in triaxial mode or 10,000 V in coaxial mode. It can also product test current to ...

Due to product requirements, an IC device may receive multiple wafer tests at several temperatures. It also may be retested to recover yield. This often occurs due to improper wafer test cell setup or ...

Full test at wafer probe obtains yield information as quickly ... to the probe tip to eliminate any signal aberrations at the device. Another common technique for increasing parallelism in DRAM ...

Vertical Goes Power: Multi-Site Wafer Probing of Automotive ICs ... of vertical probes in automotive power/logic device testing. Cantilever probes with tips sized according to current requirements ...

They also enable automated on-wafer calibrations, even when the device has a ... high throughput testing at foundries and IDMs, the fully automated FormFactor probe systems enable test engineers ...

The introduction of the double-sided wafer probe test cell is expected to have a ... before wafers are diced and packaged into CPO devices or pluggable transceivers. The integration of Teradyne's ...

test signals from a measuring instrument or tester are transmitted to individual devices on a wafer via probe needles or a probe card, and the signals are then returned from the device.