Students in a New Product Development course at UW-Stout recently completed a 3-1/2 week project developing toolless bed ...

Plastics are lightweight, durable and easy to process, making them truly versatile materials for almost any application. This ...

Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.

For food processors and manufacturers focused on operational efficiency, the Seal N’ Flip is a production-efficient packaging ...

Mars is discovering much of its packaging may be over-engineered with unnecessary features, so as it adapts to EPR ...

The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures.

The company that owns such iconic brands as Oreo, Chips Ahoy and Nutter Butter is suing no-frills grocery chain Aldi over ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

Learn how to properly fit chipboard flooring with this clear, step-by-step guide. From preparing the subfloor to laying the boards securely, this video covers everything you need for a smooth ...

(X pic) Semiconductor giant Advanced Micro Devices Inc (AMD) is seeking to establish Malaysia as a hub for advanced semiconductor packaging and design, says Prime Minister Anwar Ibrahim.