Book: Using predictive analytics and heterogeneous package workflows to design cost-effective multi-die assemblies.

Researchers from the Massachusetts Institute of Technology (MIT) and Bridgewater State University developed a new way to ...

Diversity of compute elements proliferates for inference, but the mix varies by application. With AI changing so fast, it’s a ...

Enabling EDA Flow Automation through Microservice-Based LLM Agents” was published by researchers at Duke University and University of Maryland. Abstract “Modern Electronic Design Automation (EDA) ...

Accuracy Trade-Offs in Massive MIMO Signal Detection Using SRAM-Based In-Memory Computing” was published by researchers at ...

Programmable chip-to-chip photonic fabrics in multi-accelerator servers for ML” was published by researchers at Cornell ...

A new technical paper titled “Silent Data Corruption by 10x Test Escapes Threatens Reliable Computing” was published by ...

Enabling Power Gating in Neural Processing Units” was published by researchers at the University of Illinois Urbana-Champaign ...

The promise, reality, and evolution of artificial intelligence in semiconductor manufacturing.

Kandou Bus designs high-speed, pin and energy efficient chip-to-chip links, SerDes, and associated technologies. The company’s key technology is Chord signaling. According to the company, the ...

Is AI using too much power? Some people think so, and believe the easy gains in power reduction have already been made.

This article examines the system-level challenges in enabling seamless 1.6 Tbps port-level interoperability for ...