The Takeout gathered 21 popular Cadbury chocolate bars and pitted them against one another, to find out once and for all ...

Understand flip-chip technology and its advantages over traditional wire bonding methods in semiconductor packaging.

A co-design flow of packaging and ASIC design allows customers to evaluate and balance the many factors at play. A co-design ...

Aldi, a German discount chain with U.S. headquarters in Batavia, Illinois, has faced lawsuits over its packaging before.

High-purity polysilicon is melted and poured into a mold, where it cools and solidifies to form a polycrystalline silicon ingot. The ingot is then cut, ground, and polished to obtain polycrystalline ...

We may receive a commission on purchases made from links. Finding mold anywhere in your bathroom is never a pleasant experience. You question how long it's been there and whether it could be making ...

WTF?! A Reddit user claims to have discovered an entire 12nm TSMC wafer discarded in a dumpster near one of the chipmaker's fabs in China. While it was just a test wafer, the find sparked jokes ...

Today, bulky silicon wafers serve as the main scaffold on which ... When metallurgists pour molten metal into a mold, the liquid slowly “nucleates,” or forms grains that grow and merge into ...

The mold and substrate can be separated immediately without a cooling ... 3 Depending on the application, NIL employs various substrates such as Si wafers, metal plates, glass, flexible films, and ...

Their approach is to form copper studs on a finished wafer, saw apart the die (“singulate” them), and then embed them in a mold face up. This package is then encapsulated, and an interconnect ...