Researchers from Arizona State University and Intel Foundry have published “Graph Attention-Based Virtual Metrology for Film ...

Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on ...

Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but ...

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...

Every new SoC tape-out demands broader coverage for design robustness, and the characterization workload has exploded. The ...

Researchers from Yale University, Cornell University, Boston University, and NTT Research have published “Physical Foundation Models: Fixed hardware implementations of large-scale neural networks”.

Exhaustive proofs are the only way to find deep corner-case bugs that can result in deadlocks and silent data corruption.

Temperature adds another challenge. Standard DFT is essentially a zero-temperature approach, so thermal effects must be ...

Sustaining AI progress requires energy-efficient computing with holistic co-design and co-optimization across the entire ...

Manufacturing, Packaging, Materials Navigating Increased Complexity In Advanced Packaging Intel Vs. Samsung Vs. TSMC Hybrid Bonding Makes Strides Toward Manufacturability 3.5D: The Great Compromise ...

Thermal management has become the defining bottleneck in high-performance computing (HPC) and AI accelerator packaging. Modern packages integrate high-power ASICs with multiple High Bandwidth Memory ...

Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: ...