Verification IP; system-technology co-optimization; PCIe 7.0 ordering; design data challenges; process digital twins.

The demand for performance in an AI data center is causing a huge spike in the amount of power being consumed. Within a rack ...

New research points to safer devices with less loss at low voltages, but problems remain for high-voltage industrial ...

Researchers from ETH Zurich and University of Bologna have released “CHIMERA: A Flexible and Scalable 3.1 TOPS/W AI-MCU with ...

Researchers from University of Duisburg-Essen and Fraunhofer Institute for Microelectronic Circuits and Systems have ...

Researchers from Arizona State University and Intel Foundry have published “Graph Attention-Based Virtual Metrology for Film ...

A researcher from IBM Research – Europe published “Emerging Trends in Intelligent Sensing”. Abstract “The rapid proliferation ...

We employ a straightforward stacking approach to integrate ultrathin materials with metasurfaces, overcoming the technical ...

How the standard matured from simple connectivity to secure data movement across multiple chiplets and packaging approaches.

Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on ...

Multi-die assemblies give chip architects the option to change some dies while keeping the rest of the system intact, but ...

Over the past decade or so, foundation models have emerged as the dominant paradigm for interacting with language, images, ...