EDN

Unisem rolls leadframe packaging technology

SAN JOSE, Calif. — Malaysia’s Unisem Berhad has rolled out a new, high-density leadframe packaging technology. The Leadframe Grid Array (LFGA) is said to offer I/O densities traditionally only found ...
EDN

Unisem eyes IC-packaging expansion in Chengdu

CHENGDU, China — Seeking to break out from the crowded IC-packaging pack, Malaysia’s Unisem Berhad here outlined its ambitious growth strategy amid robust demand and shortages in the market. As part ...
Business Wire

Unisem Introduces New High Density Leadframe Based Packaging Using Technology developed by TL Li (Patent Pending)

KUALA LUMPUR, Malaysia--(BUSINESS WIRE)--Unisem today announced the introduction of a new high density leadframe packaging technology, the Leadframe Grid Array (LFGA). This latest offering, developed ...
Business Wire

Unisem Continues to Invest in Fast Growing MEMS Market After Shipping 1 Billion Packaged MEMS Devices

KUALA LUMPUR, Malaysia--(BUSINESS WIRE)--Unisem recently shipped their one billionth packaged MEMS device and they continue to invest capex in both MEMS assembly equipment and the development of ...
Business Insider

Unisem Advanced Technologies Selects Two Veeco Tools to Support Expansion of Fan-Out Wafer-Level Packaging Portfolio

PLAINVIEW, N.Y., Feb. 12, 2019 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (Nasdaq: VECO) announced today that Unisem Advanced Technologies Sdn Bhd (UAT) has purchased Veeco’s WaferStorm® single wafer ...