[Jack Gassett] is developing a new breakout board for an FPGA. The chip comes in a ball grid array (BGA) package which is notoriously difficult to solder reliably. Since he’s still in development, the ...
Littelfuse Inc. (Chicago, IL) has introduced the SP1012 Series TVS Diode Array (SPA® Diodes), a miniature, five-channel 6.5 pF, 15 kV bidirectional TVS array for general-purpose electrostatic ...
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