A new chip manufacturing process from Intel Corp. failed to meet Broadcom Inc.’s expectations in a recent evaluation, Reuters reported today. The development may mark a setback for Intel’s foundry ...
TSMC has announced a breakthrough chip fabrication technology, with reduced node size, increased performance and better power management — all of which should ultimately lead to faster iPhones and ...
Analyst Ming-Chi Kuo has echoed other reports that Apple is expected to use a new chip packaging technology in the A20 chip, which will debut in the iPhone 18 next year. His report focuses on ...
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