Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of ...

The data comes from a thermal STCO (system-technology co-optimization) study of integrating high-bandwidth memory (HBM) on a ...

Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...

Samsung Electronics is currently dedicated to the R&D of 11nm level DRAM and ninth-generation 3D NAND Flash. The goal is to raise integration to the highest level in the industry, realize its existing ...

Memory startup d-Matrix is claiming its 3D stacked memory will be up to 10x faster and run at up to 10x greater speeds than HBM. d-Matrix's 3D digital in-memory compute (3DIMC) technology is the ...

3D TSV stacking technology is expected to account for the largest share of the 3D stacking market during the forecast period TSV technology is instrumental in the development of 3D stacking DRAMs, ...

NOR flash memory is evolving much in the same way as its cousin, NAND flash: 3D NOR is on the horizon and poised to boost memory densities and dramatically enhance designs. Evolving electronic systems ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...

After memory products like NAND Flash and DRAM, it's reported that Samsung Electronics will conduct R&D for a "3D stacking" technology that can vertically stack system semiconductor transistors.

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Advanced Micro Devices is announcing it is shipping its third-generation ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...