As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
A novel power supply technology for 3D-integrated chips has been developed by employing a three-dimensionally stacked computing architecture consisting of processing units placed directly above stacks ...
The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...
NEW YORK, Oct. 15, 2024 /PRNewswire/ -- According to a new comprehensive report from The Insight Partners, the rising consumer electronics industry is a significant driver for the global 3D stacking ...
The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...
Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand. PSMC stated that major ...
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog post. The latest ...
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