Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor ...

The days of “throwing it over the wall” are over. Heterogeneous integration is ushering in a new era of silicon chip design with collaboration at its core—one that lives or dies on seamless ...

The Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO) is requesting information to guide the establishment of a domestic research and development (R&D) center for ...

The development of computing technology in the late 18th century led to a change in computer architecture from the 1960s 2D drawing age to the present-day machine learning era, which uses algorithms, ...

As Japan is developing the technology for mass-producing 2nm chips, they are not only trying to increase the transistor density on a single die but also to combine multiple dies with heterogeneous ...

Scientists in NEXT Lab, Tsinghua University have revealed the fabrication and engineering techniques of TMDs and provided a comparative view between TMDs and traditional semiconductors, demonstrating ...

Medical device designers are at the forefront of a technological renaissance. From wearable monitors and implantable sensors to lab-on-a-chip (LoC) diagnostics, today's medical innovations are more ...

The role of memory chips has become increasingly important in heterogeneous integration, and Winbond Electronics is working with potential customers in multiple related design projects, according to ...

Are you feeling nostalgic for homogeneous integration of chips – one flat board where you can use your fingers to stuff in all the circuitry you need? Best to head to the Lego store or Russia. The ...

The Nature Index 2025 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...