Third-party sensors are being added into fab equipment to help boost yield and to extend the life of expensive tools, supplementing the sensors that come with equipment used in fabs. The data gleaned ...

TL;DR: NVIDIA is exploring CoWoP PCB packaging for its next-gen Rubin R150 AI GPUs, offering improved signal and power integrity, enhanced thermals, and reduced costs by eliminating the package lid.

The ASIL-C sensor is claimed to be the smallest in the industry, while the module targets driver-monitoring hardware. Among the primary challenges facing engineers developing imaging sensors for ...

Syntiant Corp., the recognized leader in ultra-low-power edge AI deployment, today announced two new package options for its NDP115 Neural Decision Processor(TM), extending the chip's reach into ...

Piher Sensors & Controls has introduced the MTS-360 Mechanical Mount Rotary Position Sensor with integral PCB for fast and easy mounting. Designed with the sensor directly mounted onto a PCB, the ...