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Yahoo Finance11mon
The Latest Breakthrough in Silicon Carbide Wafer Edge Profiling
Synova's Laser MicroJet Ò (LMJ) technology achieves outstanding results in SiC wafer edge beveling and profiling and is set to revolutionize the semiconductor industry. DUILLIER, Switzerland ...
EurekAlert!2y
Schematic of various optical systems that are capable of tackling the diverse challenges in patterned defect inspection (IMAGE)
Diverse optical wafer defect inspection systems including (a) Brightfield/darkfield imaging system, (b) Dark-field imaging with null ellipsometry, (c) Through-focus scanning imaging microscopy ...
Finanznachrichten11mon
Synova S.A.: The Latest Breakthrough in Silicon Carbide Wafer Edge Profiling
Synova's Laser MicroJet Ò (LMJ) technology achieves outstanding results in SiC wafer edge beveling and profiling and is set to revolutionize the semiconductor industry. DUILLIER, Switzerland ...