Figure 2: Design of the silicon wafer mold. Fabrication of the silicon wafer mold. The microstructures of the microfluidic dissection platform are produced by casting PDMS against a silicon wafer ...

In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...

Liquid PDMS(Opens in a new window) (a transparent silicone polymer) is then poured over the silicon wafer mold and cured. The electrode chemicals are dripped into the molded narrow channels and ...

A*STAR IME’s research is centered around three architecture families: high density fan-out wafer-level packaging (HD FOWLP), 2.5D interposer and 3D interposer, from which eight platforms are derived: ...