Dublin, Jan. 31, 2024 (GLOBE NEWSWIRE) -- The "Global 3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid ...
To minimise stacking height in mobile devices, GTK is launching Microstak – a miniature plug-and-socket SMT connector for interfacing stacked PCBs in mobile phone handsets, notebook PCs, PDAs, pagers ...
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