SINGAPORE — ST Assembly Test Services Ltd. (STATS) today rolled out an enhanced version of its plastic ball-grid array package with a patented heat dissipation technology that enables the PBGA to ...

SANTA CLARA, Calif. — ChipPac Inc. here announced plans to expand production of plastic ball-grid array (PBGA) packages at its Malaysia plant to support the growth of third-party silicon foundries in ...

VALLEY COTTAGE, N.Y. – Surface mount technology also called as SMT is a technique of mounting electronic components on the surface of printed circuit boards. Ball Grid Array also called as BGA is one ...

SiliconBlue Technologies has made available functioning samples of the new iCE40 "Los Angeles" mobileFPGA family including the LP-Series (Low-Power) and the HX-Series (High-Speed) families targeting ...

Housed in a 13- by 22-mm, 159-contact, plastic BGA package, the W78M4V-XSBX flash-memory component provides 64 Mbytes of storage. That storage can be configured as either 8 Mwords by 64 bits, two ...

The Ball Grid Array (BGA) Package Market is poised for steady growth as the demand for compact, high-performance Semiconductor packaging continues to rise. Valued at $4.6 billion in 2023, the market ...

SANTA CLARA, Calif.-- October 31, 2011--SiliconBlue® Technologies, the leader in Custom Mobile Device™ (CMD), today announced sampling availability of three new iCE40™ “Los Angeles†640, 1K ...