Broadcom Inc. today detailed a new chip packaging technology, XDSiP, that makes it possible to create processors by stacking multiple silicon dies atop another. XDSiP is short for eXtreme Dimension ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

Jinman Han is President of Samsung Semiconductor, Inc. & leads the U.S. business, including Memory, Foundry, System LSI and LED. Almost every innovation introduced to the world has been touted as the ...

Project is being supported by $75 million federal grant and $20 million from New York state; GF will also spend $186 million on research GlobalFoundries' Fab 8 campus is seen in February 2024 in Malta ...

TSMC is plotting another big move in its American push, this time with plans to manufacture some of its most advanced chip packaging tech in the US to loosen its dependency on Taiwan. The firm’s ...

Chip-giant Intel (NASDAQ: INTC) is dead set on reclaiming its manufacturing edge over foundry leader TSMC. The company's manufacturing roadmap includes launching five nodes in a four-year span.

Samsung Electronics Co (OTC:SSNLF), a leading South Korean tech company, plans to invest approximately 40 billion yen ($280 million) over five years in a new advanced chip packaging research facility ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...