In this study, experiments and mold flow simulation results are presented for a void-free wafer level molded underfill (WLMUF) process with High-Density Fan-Out (HDFO) test vehicles using a ...

Warpage control test Warpage control of a 300-mm molded wafer is a crucial problem for FOWLP technology development. During our test at Brewer Science, we found that FEA using a 3D model was useful ...

including silicon wafers, glass substrates, and molded wafers, ensuring adaptability for diverse packaging requirements. This fully automated solution redefines efficiency and precision in ...

stacked wafers, MEMS, and over-molded wafers. "The SpinSAM AMI system represents a significant advancement in wafer inspection technology, offering customers unmatched speed and precision to ...

FREMONT, CA / ACCESS Newswire / February 28, 2025 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has completed shipment of ...