The patent was filed 18 months ago, and there's no further indication of ongoing development ...

Xilinx delivers big, fast FPGAs pushing 28nm technology (see Xilinx Unifies FPGA Line). So how do you improve on the cutting edge? How about stacking a bunch of FPGA slice together. That is what ...

Interposer Package-on-Package (PoP) technology was developed and has been in very high-volume production over the last several years for high-end mobile application processors (APs). This is due to ...

Fig 1. The Xilinx Virtex-7 2000T, at 6.8 billion transistors, is the largest FPGA around (a). It’s implemented using 2.5D Stacked Silicon Interconnect technology (b). Fig 2. Xilinx’s Stacked Silicon ...

Intel has released details on a new interconnect approach that it's using for future FPGAs, and could make available in CPUs as well, if demand is significant. Share on Facebook (opens in a new window ...

The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates.

CHESTNUT RIDGE, N.Y., Feb. 23, 2021 /PRNewswire/ -- Teledyne LeCroy introduced the CrossSync™ PHY interposers and software options, enabling the first-ever link between an oscilloscope and a protocol ...