Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level personnel ...
Chairman Jim Hung said Innolux will deprioritize shipment volume for its fan-out panel-level packaging (FOPLP) business in 2026, shifting its focus to redistribution layer (RDL) and through-glass via ...
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