ST has introduced five power-semiconductor bridges in various configurations, housed ST’s ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.

STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in its ACEPACK SMIT package making assembly easier and enhancing power density over conventional TO ...

Due to the ever increasing demands to drive up DC-DC power converter density, topologies that had previously been used only in high power applications are now finding their way into medium and lower ...

Technology developed for driving synchronous FETs in flyback topologies can be directly applied in LLC topologies. This technology offers significant gains in efficiency for applications with low ...