Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

Chang Wah Electromaterials (CWE), a Taiwanese supplier of semiconductor and electronics materials and equipment, is transitioning from 12-inch wafer-level packaging to panel-level fan-out packaging ...

ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves the integrated ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...

In current designs, both the DRAM and the HPB sit on top of the processor. That means the HPB mainly helps cool the CPU and GPU, while the memory — which also heats up under load — doesn’t benefit as ...

“The demand for high bandwidth memory (HBM) has driven the need for advanced packaging solutions, particularly those involving fan-out layers to interconnect wafers within packages. To meet the ...

The research team led by Distinguished Research Fellow Dr. Jun-Yeob Song at the Semiconductor Manufacturing Research Center, KIMM, is holding a large rectangular panel developed in collaboration with ...