Alpha and Omega Semiconductor Limited released a family of low on-resistance 8V, 20V, and 30V MOSFETs in the ultra-thin molded chip scale package (MCSP). The MCSP devices feature a maximum height of ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
can be mounted on a flexible or rigid substrate. The battery is capable of greater than 10,000 ...
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