LIVERMORE, Calif. — FormFactor Inc. here today (Feb. 15) announced a major advancement in probe-card technology that enables IC manufacturers to test up to 128 chips on a wafer with a single ...

Full test at wafer probe obtains yield information as quickly ... to the probe tip to eliminate any signal aberrations at the device. Another common technique for increasing parallelism in DRAM ...

Due to product requirements, an IC device may receive multiple wafer tests at several temperatures. It also may be retested to recover yield. This often occurs due to improper wafer test cell setup or ...

Vertical Goes Power: Multi-Site Wafer Probing of Automotive ICs ... of vertical probes in automotive power/logic device testing. Cantilever probes with tips sized according to current requirements ...

When it comes to testing VCSEL devices on wafer, however, there are multiple challenges. A major requirement is single and dual-sided testing – probing from the front or backside of the wafer. The ...

They systems provide fully automated testing capability for one of three critical device characterization ... still more sophistication to the probe head design, to provide a complete electro-optical ...

The brief was that the wafer probe yield was disastrous and the ... the tester interfaces to the application. A typical test floor with a device handler shown docked to a test head The idea ...

the wafer is brought into contact with the probes and the test is performed. Each time the wafer is moved to test a different device the thermal gradient changes and the equilibrium is disturbed. At ...

and integrated optical devices. The WaferPak Contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of ...

test signals from a measuring instrument or tester are transmitted to individual devices on a wafer via probe needles or a probe card, and the signals are then returned from the device.