New D2D interface IP offers more than 3x bandwidth density of equivalent UCIe interface while requiring far less silicon Advanced power management capability automatically adapts to bursty data center ...
Marvell Technology, Inc. has claimed the industry’s first 2-nm 64 Gbits/s bi-directional die-to-die (D2D) interconnect, offering higher bandwidth and efficiency together with advanced power management ...
Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance, driven by applications like ChatGPT based on large language models (LLMs). This requires ...
Recent months have seen new advances in chiplet standardization. For example, consortia such as Bunch of Wires (BoW) and Universal Chiplet Interconnect Express (UCIe) have made progress in developing ...
Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized ...
At the recent Mobile World Conference 2026 in Barcelona, the strong presence of Direct-to-Device (D2D) satellite services and the avalanche of press releases related to contracts signed between D2D ...
HAIFA, Israel, Oct. 26, 2022 /PRNewswire/ -- proteanTecs, a global leader of deep data analytics for advanced electronics, announced the results of its collaboration with advanced ASIC provider, ...
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