Moore’s Law has shifted toward advanced packaging over the past few years, but the limits of that approach are just now coming into focus. AI and HPC designs are growing larger ...

Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

It's not just AMD, but Intel, Samsung, LG Innotek, and SK Group's US subsidiary Absolics are all systems pushing into glass substrate technology for advanced packaging. Intel announced in September ...

Intel has revealed more details today about its "breakthrough" glass substrate technology - a new way to manufacture processors that promises numerous benefits to todays standard organic substrate ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

As advanced packaging technologies and large-size integrated substrate solutions become key development areas for technology firms, glass substrate technology has emerged as a focal point, attracting ...

Absolics says its facility can currently produce a maximum of 12,000 square meters of glass panels a year. That’s enough, Lee ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

Corning Incorporated GLW is focusing on expanding its portfolio of durable cover materials to gain a competitive advantage against rivals. The Corning Gorilla Glass Ceramic boasts an advanced ...