SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...
Alphawave Semi (LSE: AWE), a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has announced the successful tape-out of its cutting edge UCIe™ 3D ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D and 3D Advanced ...
Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
WILSONVILLE, Ore., June 8, 2017 /PRNewswire/ -- Mentor, a Siemens business, today announced that Stream TV Networks' R&D center SeeCubic has successfully used Mentor's Catapult ® High-Level Synthesis ...
The history of electronic design has been defined by repeated waves of major technological change and accompanying business realignment. Many companies have foundered and disappeared when they were ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
Founded in 2014, 3D-IP Semiconductors operates in Advanced Hardware & Technology offering solutions in semiconductor design and emerging technologies, including ...
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